IC Sockets
IC sockets are soldered onto circuit boards, allowing semiconductor chips to be securely inserted after the soldering process. These semiconductor sockets act as placeholders, facilitating the safe and easy insertion and removal of IC chips without risking damage to the components or the board.
An IC socket serves as a connector that electrically links an integrated circuit (IC) to a printed circuit board (PCB). It is designed to facilitate the testing of electrical properties and to assess the reliability of the IC.
These sockets allow for repeated testing, enabling users to insert and remove multiple ICs without causing damage, making them ideal for reliability evaluations.
IC sockets can generally be categorized into two main types.
The first category includes sockets for standard package types like SOP (Small Outline Package) and DIP (Dual In-line Package). These sockets are cost-effective and widely available, making them suitable for testing and evaluating ICs under normal conditions, such as room temperature.
The second category consists of sockets designed for custom package types used during the IC manufacturing process. These sockets are often exposed to demanding environments and are utilized for screening ICs under rigorous conditions.
Custom IC sockets can be further divided into two types:
- Burn-in (BI) Sockets: Used to identify early defects in ICs by applying voltage or signals under high-temperature stress, ensuring reliability before deployment.
- Test Sockets: Used to evaluate the electrical characteristics of ICs and conduct final testing to confirm they meet the required specifications.
The choice of IC socket depends on its intended purpose and the specific testing environment.
MiniATE has established itself as a leader in IC sockets and semiconductor sockets technology, crucial for pre-shipment inspection in the semiconductor industry. Recognized by top semiconductor manufacturers worldwide, the company’s reputation stems from its advanced development capabilities, proprietary high-performance resin technology, and rigorous quality assurance systems, all of which support the development and mass production of semiconductors.
MiniATE continuously advances technology by staying ahead of semiconductor trends. Among the IC socket contact solutions we offer advanced designs for high-frequency measurements, and thermal resistance technology for higher temperature ratings, ensuring BGA sockets, QFP sockets, and other solutions meet the demanding requirements of semiconductor testing.
Simulation Technology
For contact technology solutions, we developed new simulation technologies that make full use of three-dimensional CAD, helping customers’ engineering design.
— Thermal analysis —
Verifying the heat dissipation through the heat sink in order to optimize socket materials and shape.
— Strength analysis —
Strength analysis conducted on molded parts and contact pins is reflected in IC socket design.
— 3D operation verification —
A three-dimensional perspective of the finished IC socket product, to verify the performance of the structure.
Basic Technology
Corresponding to a wide variety of products, small lot production, and short delivery times.
Design and development making full use of advanced 3D technology.
Design capabilities that make full use of three-dimensional CAD simulation technology. Things such as 3D automatic measurement technology allows us to meet more sophisticated requirements and construct a very high-level environment for design and development. Exercising full command of a variety of tools for multifaceted analysis, we have established a system that can deliver reliable products in a timely manner.
An original production system that enables short delivery times.
Automated assembly production system. A flexible production system that can respond to a wide variety of products. This unique system can reliably produce a mix of small lots all with short lead times.
Main Simulation Technology
Challenges in the IC Manufacturing Process and Their Solutions
Custom IC sockets used during the IC manufacturing process face various challenges that require specific solutions to ensure efficiency and reliability. Below are the key concerns and corresponding solutions:
1. Thermal Runaway
Thermal runaway is a common issue during burn-in (BI) testing. To address this, BI sockets should be designed using thermal simulation data and equipped with optimized solutions like heat sinks, heat pipes, or systems for individual temperature control.
2. High Current
High current can exacerbate thermal runaway. Effective thermal management strategies, such as using heat sinks or multiple contact pins to dissipate heat, are essential for preventing damage.
3. High Frequency
Modern ICs like CPUs and GPUs operate at high frequencies. Test sockets must be designed to minimize insertion loss and return loss by selecting contact pins specifically suited for high-frequency applications.
4. Durability
Contact pins in IC sockets often face issues such as plating wear and solder transfer. Applying appropriate plating and coatings to the contact pin tips, based on the test environment, can improve durability and prevent these problems.
5. Ease of Operation
Maintaining a reliable connection between the IC and contact pins often requires significant pressing force, making manual insertion and removal difficult. Sockets with mechanisms such as bail systems can simplify this process while ensuring sufficient contact force.
6. Compatibility with Auto Loaders
In mass production, ICs are typically inserted into sockets using auto-loading machines. IC sockets must be designed to be fully compatible with auto-loaders to streamline the production process.
7. Contact Stability
IC sockets endure both electrical and thermal stress during testing. Ensuring stable contact requires the use of specialized plating and modifications to the shape of contact pin tips, tailored to the specific testing environment.
8. Foreign Materials
In applications like testing CMOS image sensors, physical contamination can obstruct inspections. Designing IC sockets with features to prevent the entry of foreign materials is critical to ensure accurate testing.
9. Versatility
Custom IC sockets often incur higher costs. However, combining a molded frame with customizable modules to accommodate varying package thicknesses can enhance flexibility and reduce expenses.
10. High Pin Count
As IC functionality increases, the number of pins rises, and pin spacing becomes tighter. Selecting cost-effective contact pins that meet the necessary specifications is essential to manage these requirements effectively.
11. Cost Management
The cost of custom IC sockets can be high. Using modular designs, such as combining molded frames and modules, helps achieve cost efficiency while maintaining performance standards.
By addressing these challenges with appropriate solutions, IC sockets can meet the rigorous demands of the IC manufacturing process.
Selecting the Ideal IC Socket
When specifying a custom IC socket for the manufacturing process, it is crucial to define the testing objectives and understand the conditions in which the tests will be conducted.
Equally important is gaining insight into the innovative solutions and technologies offered by IC socket manufacturers.
This approach ensures that the selected socket meets both the functional and environmental requirements of the testing process.
Solutions We Provide
We offer a comprehensive range of solutions tailored to meet your IC testing and manufacturing needs. Our offerings include:
Open Top Solution
NP631 Series
Features
- Tweezer Contact Design: Minimizes ball damage during use.
- Dual-Point Contact Structure: Ensures superior contact reliability.
- Versatile Compatibility: Supports a wide range of package thicknesses.
- Pitch Support: Designed for 0.65-mm pitch applications.
Specifications (operating temperature range)
-40°C to 150°C
Category 1 – Micro, Logic, Analog
Category 2 – BGA
NP584 Series
Features
- Tailored for Low-Volume, High-Variety Production: Designed to meet diverse manufacturing needs.
- Wide Range of Contacts: Extensive options to suit various applications.
- Pitch Compatibility: Supports pitches of 0.30 mm and above, including staggered and irregular configurations.
- Package Size Range: Accommodates sizes from 2.00 mm to 20.00 mm square.
- Supported Package Types: Compatible with BGA, LGA, QFN, and SON packages.
Category 1 – Micro, Logic, Analog
Category 2 – BGA, LGA, QFN, SON
Specifications (operating temperature range)
-40°C to 150°C
NP583 Series
Features
- 0.5-mm Pitch Open-Top Socket: Specifically designed for QFN packages.
- Center-Ground Pad Compatibility: Ensures seamless functionality with center-ground pads.
- Compact Design: Optimized for space-saving applications.
Category 1 – Micro, Logic, Analog
Category 2 – QFN
Specifications (operating temperature range)
-40°C to 150°C
NP566 Series
Features
- Tweezer Contact Design: Minimizes ball damage during operation.
- Dual-Point Contact Structure: Provides enhanced contact reliability.
- Wide Thickness Compatibility: Supports a variety of package thicknesses.
- 0.8-mm Pitch Support: Suitable for applications with 0.8-mm pitch.
Category 1 – Micro, Logic, Analog
Category 2 – BGA
Specifications (operating temperature range)
-40°C to 150°C
NP560 Series
Features
- Twin Beam Press Contacts: Designed to minimize pad scratches.
- Versatile Compatibility: Supports a broad range of package thicknesses.
Category 1 – Micro, Logic, Analog
Category 2 – SON
Specifications (operating temperature range)
-40°C to 150°C
NP559 Series
Features
- Tweezer Contact Design: Reduces ball damage during use.
- Dual-Point Contact Structure: Ensures high reliability in connections.
- Broad Thickness Compatibility: Suitable for various package thicknesses.
- 1.0-mm Pitch Support: Optimized for applications with 1.0-mm pitch.
Category 1 – Micro, Logic, Analog
Category 2 – BGA
Specifications (operating temperature range)
-55°C to 150°C
NP556 Series
Features
- U-Shaped Contact Design: Protects the underside of the ball from damage.
- Surface-Mount Contacts: Available for versatile applications.
- Low-Profile Ball Compatibility: Suitable for packages with low-profile balls.
- 0.65-mm Pitch Support: Designed for precision in 0.65-mm pitch applications.
Category 1 – Micro, Logic, Analog
Category 2 – BGA
Specifications (operating temperature range)
-40°C to 150°C
NP506 Series
Features
- Open-Top Socket for QFNs: Designed for 0.5-mm pitch applications.
- Center-Ground Pad Compatibility: Ensures reliable performance with center-ground pads.
- Compact Size: Engineered for space-efficient use.
Category 1 – Micro, Logic, Analog
Category 2 – QFN
Specifications (operating temperature range)
-40°C to 150°C
NP483 Series
Features
- Tweezer Contact Design: Reduces ball damage for improved durability.
- Dual-Point Contact Structure: Ensures reliable and stable connections.
- Anti-Sticking Mechanism: Prevents balls from adhering to the contact surface.
- Versatile Thickness Compatibility: Supports a wide range of package thicknesses.
- 1.0-mm Pitch Support: Optimized for 1.0-mm pitch applications.
Category 1 – Micro, Logic, Analog
Category 2 – BGA
Specifications (operating temperature range)
-40°C to 150°C
Clamshell
IC642 Series
Features
- Ideal solutions for low-volume, high-variety production.
- Pitch options starting from 0.40 mm, including staggered and irregular pitches.
Category 1-Logic, Analog, Power device
Category 2- BGA, LGA, QFN, SON
IC630 Series
Features
- Tailored solutions for low-volume, high-variety production.
- Pitch options starting at 0.30 mm, with staggered and irregular pitches available.
- Standard cartridge heaters and temperature sensors offered.
- Compatible with BGA, LGA, QFN, and SON packages.
Category 1- Micro, Logic, Analog
Category 2 – BGA, LGA,QFN, SON
IC610 Series
Features
- 50-mm pitch clamshell socket designed for QFNs.
- Compatible with center-ground pads.
- Compact and space-efficient design.
Category 1 -Micro, Logic, Analog
Category 2 – QFN
Test Sockets – Probe
IC588 Series
Features
- Fully customizable sockets with spring probe pins to meet specific customer requirements.
- In-house component production enables the creation of special shapes and packages.
Category 1 – Memory, Micro, Logic, Analog, Power device, Sensor, RF device, Optical device, Module
Category 2 – BGA, LGA, QFN, QFJ
IC544 Series
Features
- Custom socket with a 1.6-mm test length for BGAs and LGAs.
- Supports high-frequency applications.
- Compatible with 0.8-mm pitch or larger.
Category 1 – Memory, Micro, Logic, Analog, Power device, Sensor, RF device, Optical device, Module
Category 2 – BGA, LGA
IC434 Series
Features
- Custom socket with spring probe pins.
- 5-mm pitch with a test length of up to 4.0 mm.
Category 1 – Memory, Micro, Logic, Analog, Power device, Sensor, RF device, Optical device, Module
Category 2 – BGA, LGA, QFP, QFN, SOP, SON
Cantilever
IC53 Series
Features
- Compatible with various surface-mount IC packages, including SOP, QFP, and more.
- High reliability, exceptional heat resistance, and durability, backed by extensive sales experience.
- Custom-made solutions available for specialized packages, such as multi-pole and ultra-small pitch sockets.
Category 1 – Memory, Micro, Logic, Analog, Sensor, Optical device
Category 2 – QFP, QFN, SOP, SON
IC51 Series
Features
- Sockets for SOP/QFP
• High reliability and excellent heat resistance and durability achieved through long-term sales experience.
• Custom-made products for special packages, such as multi-pole and ultra-small pitch sockets, available.
Category 1 – Memory, Micro, Logic, Analog, Sensor, Optical device
Category 2 – SOP
IC299 Series
Features
- High-frequency socket with pressed contacts for SOPs/QFPs
• Supports 0.4-mm to 0.8-mm pitches.
Category 1 – Memory, Micro, Logic, Analog
Category 2 – QFP, SOP
FAQs
What are IC sockets used for?
IC sockets are used to securely mount integrated circuits (ICs) on printed circuit boards (PCBs) without soldering. They allow easy replacement or upgrades of ICs in electronic devices.
What types of IC sockets are available?
Common types of IC Sockets include burn-in sockets, test sockets, BGA , LGA, QFN, QFP, PGA sockets, each designed for specific testing, development, or production purposes.
How do I choose the right IC socket?
Consider factors like the type of IC, pin count, pitch, and the intended application (e.g., testing or permanent installation).
Can I customize IC sockets for specific needs?
Yes, we offer customizable IC sockets to meet specific requirements, such as unique pin configurations or materials.
How can I request a quote for IC sockets?
To request a quote, please contact us directly via email. Provide details like the type, quantity, and any specific requirements.
What is the minimum order quantity for IC sockets?
The minimum order quantity (MOQ) varies depending on the socket type and customization needs. Contact us for specific MOQ information.
How do I order an exact match IC socket?
To order an exact match, provide the IC part number , IC POD / Mechanical Drawing, socket type, and any specific pin configurations. Our team will assist in ensuring you get the correct socket.
What is the key difference between IC Sockets and Semiconductor sockets?
IC sockets and semiconductor sockets are similar but not exactly the same. All IC sockets are a type of semiconductor socket, but not all semiconductor sockets are designed exclusively for ICs. Semiconductor sockets serve a wider range of devices beyond traditional ICs and are commonly used in high-end testing and validation processes.
What are the main applications of semiconductor sockets?
Semiconductor sockets are used to securely connect integrated circuits (ICs) to test equipment or circuit boards without soldering. Their main applications include:
- IC Testing & Validation – Used in burn-in, functional, and reliability testing to assess IC performance before final assembly.
- Prototyping & Development – Enable engineers to test different chips without permanent soldering, allowing for quick modifications.
- Production & Quality Control – Facilitate efficient testing in manufacturing processes to ensure ICs meet quality standards.
- Device Programming – Used in programming and reprogramming ICs, such as microcontrollers and memory chips.
What are the components of a semiconductor socket?
A semiconductor socket consists of several key components designed to provide a secure and reliable connection for integrated circuits (ICs). These components include:
- Contact Pins/Leads – Spring-loaded or fixed metal contacts that establish electrical connections with the IC’s pins.
- Socket Base – The main body, typically made of high-temperature plastic or ceramic, which houses the contacts and provides mechanical support.
- Retention Mechanism – Clips, latches, or zero insertion force (ZIF) mechanisms that hold the IC securely in place.
- Insulation Material – Prevents electrical short circuits and enhances signal integrity by isolating contacts.
- Heat Dissipation Features – Some sockets include thermal pads, heat sinks, or vents to manage heat during high-power applications.
- Guide Pins & Alignment Features – Ensure proper IC positioning and prevent misalignment or damage during insertion.
- Mounting Interface – Surface-mount or through-hole solder pads for attaching the socket to a printed circuit board (PCB).
Manufacturer’s Representative MiniATE Systems specializes in sales & marketing of innovative interconnect solutions with technologically advanced features. Our product range offers high reliability in development, test, validation, and production level device-to-board and board-to-board applications.
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Contact
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info@miniate.com
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